FS01 – THz Communications: Approaches for Circuit, Antenna, Signal Processing, and System Design

Organized by: Meik Dörpinghaus and Gerhard Fettweis (both TU Dresden)

Ter­a­hertz com­mu­ni­ca­tions promise very high data rates in future wire­less com­mu­ni­ca­tions sys­tems by exploit­ing the large avail­able band­width in the ter­a­hertz spec­trum. How­ev­er, for their real­iza­tion still many chal­lenges have to be addressed. In this regard, this spe­cial ses­sion will focus on var­i­ous aspects of future ter­a­hertz com­mu­ni­ca­tions sys­tems from anten­nas over cir­cuits to sig­nal pro­cess­ing and will bring togeth­er researchers from these dif­fer­ent areas.

FS02 – Photonic Integrated Circuits for Microwave/RF Signal Processing

Organized by: Kambiz Jamshidi (TU Dresden) and Thomas Schneider (TU Braunschweig)

Pho­ton­ic tech­nolo­gies offer extreme­ly high band­width, are immune to elec­tro­mag­net­ic inter­fer­ence with radio fre­quen­cies, and have the poten­tial to process high-band­width elec­tri­cal sig­nals from the microwave to the THz domain. Espe­cial­ly, pho­ton­ic inte­grat­ed cir­cuits (PICs) can pro­vide a solu­tion to real­ize small-foot­print devices with a low pow­er con­sump­tion that can be fab­ri­cat­ed in exist­ing foundries. In this focused ses­sion, researchers are invit­ed to sub­mit their research in the field of devices or sys­tems that ben­e­fit from PIC tech­nol­o­gy for pro­cess­ing microwave, RF, or THz sig­nals.

FS03 – Body Area Communications: Recent Advancements and Experimental Results

Organized by: Ilangko Balasingham (NTNU, Norway) and Robin Augustine (Upsala University, Sweden)

Body Area Com­mu­ni­ca­tions (BAC) encom­pass­es advanced tech­nolo­gies enabling seam­less inter­ac­tion between devices in or on the human body, such as wear­ables and implants. These sys­tems lever­age wire­less pow­er trans­fer and inno­v­a­tive tech­niques like backscat­ter com­mu­ni­ca­tion to opti­mize ener­gy effi­cien­cy. Emerg­ing meth­ods, such as fat intra-body com­mu­ni­ca­tion, exploit human tis­sue prop­er­ties to enhance sig­nal trans­mis­sion.

BAC sup­ports two-way com­mu­ni­ca­tion for stim­u­la­tion and sens­ing, allow­ing appli­ca­tions in health mon­i­tor­ing, ther­a­peu­tic inter­ven­tions, and aug­ment­ed human capa­bil­i­ties. Exper­i­men­tal plat­forms have demon­strat­ed promis­ing results, paving the way for more reli­able, effi­cient, and inte­grat­ed body-area net­works. These advance­ments rep­re­sent a sig­nif­i­cant leap in merg­ing human phys­i­ol­o­gy with cut­ting-edge wire­less tech­nolo­gies. The ses­sion will fea­ture results, among oth­ers, from the ongo­ing Hori­zon Europe Pathfind­er Open Project B‑cratos (Mod­ern BCI — B‑Cratos).

FS04 – Joint Communication and Sensing

Organized by: Padmanava Sen (Barkhausen Institut)

The ses­sion will cov­er the anten­na and pack­ag­ing aspects as well as beam pre­dic­tion in the con­text of Joint Com­mu­ni­ca­tions and Sens­ing (JC&S) Appli­ca­tions. Con­sid­er­ing hard­ware reuse, the design, and devel­op­ment of anten­nas will prove to be a key enabler for deploy­ment of JC&S sys­tems in 6G and beyond.

FS06 – Electronics Packaging for RF-Applications – Integration Challenges and Solutions

Organized by: Krzysztof Nieweglowski, Karsten Meier and Karlheinz Bock (all TU Dresden)

Elec­tron­ics pack­ag­ing inte­gra­tion tech­nolo­gies are enablers for the real­iza­tion of RF-sys­tems with appli­ca­tion dri­ven require­ments in regard to the per­for­mance and cost-effi­cient fab­ri­ca­tion, e.g. Anten­na-in-Pack­age solu­tions can pro­vide small form fac­tor mod­ules with matched char­ac­ter­is­tics and low pow­er con­sump­tion. In this focused ses­sion, the experts will dis­cuss emerg­ing tech­nolo­gies for het­eroin­te­gra­tion of RF-sys­tems intro­duc­ing nov­el sub­strate mate­ri­als and man­u­fac­tur­ing meth­ods for mul­ti­lay­er sig­nal re-dis­tri­b­u­tion and feed­ing net­works incl. advanced RF-char­ac­ter­i­za­tion, explor­ing RF-matched assem­bly tech­nolo­gies as well as show­ing inno­v­a­tive sim­u­la­tion-dri­ven co-design tech­niques.

… more com­ing soon.