Program

Focus Sessions

FS01 – THz Communications: Approaches for Circuit, Antenna, Signal Processing, and System Design

Organized by: Meik Dörpinghaus and Gerhard Fettweis (both TU Dresden)

Ter­a­hertz com­mu­ni­ca­tions promise very high data rates in future wire­less com­mu­ni­ca­tions sys­tems by exploit­ing the large avail­able band­width in the ter­a­hertz spec­trum. How­ev­er, for their real­iza­tion still many chal­lenges have to be addressed. In this regard, this spe­cial ses­sion will focus on var­i­ous aspects of future ter­a­hertz com­mu­ni­ca­tions sys­tems from anten­nas over cir­cuits to sig­nal pro­cess­ing and will bring togeth­er researchers from these dif­fer­ent areas.

FS02 – Photonic Integrated Circuits for Microwave/RF Signal Processing

Organized by: Kambiz Jamshidi (TU Dresden) and Thomas Schneider (TU Braunschweig)

Pho­ton­ic tech­nolo­gies offer extreme­ly high band­width, are immune to elec­tro­mag­net­ic inter­fer­ence with radio fre­quen­cies, and have the poten­tial to process high-band­width elec­tri­cal sig­nals from the microwave to the THz domain. Espe­cial­ly, pho­ton­ic inte­grat­ed cir­cuits (PICs) can pro­vide a solu­tion to real­ize small-foot­print devices with a low pow­er con­sump­tion that can be fab­ri­cat­ed in exist­ing foundries. In this focused ses­sion, researchers are invit­ed to sub­mit their research in the field of devices or sys­tems that ben­e­fit from PIC tech­nol­o­gy for pro­cess­ing microwave, RF, or THz sig­nals.

FS03 – Body Area Communications: Recent Advancements and Experimental Results

Organized by: Ilangko Balasingham (NTNU, Norway) and Robin Augustine (Upsala University, Sweden)

Body Area Com­mu­ni­ca­tions (BAC) encom­pass­es advanced tech­nolo­gies enabling seam­less inter­ac­tion between devices in or on the human body, such as wear­ables and implants. These sys­tems lever­age wire­less pow­er trans­fer and inno­v­a­tive tech­niques like backscat­ter com­mu­ni­ca­tion to opti­mize ener­gy effi­cien­cy. Emerg­ing meth­ods, such as fat intra-body com­mu­ni­ca­tion, exploit human tis­sue prop­er­ties to enhance sig­nal trans­mis­sion.

BAC sup­ports two-way com­mu­ni­ca­tion for stim­u­la­tion and sens­ing, allow­ing appli­ca­tions in health mon­i­tor­ing, ther­a­peu­tic inter­ven­tions, and aug­ment­ed human capa­bil­i­ties. Exper­i­men­tal plat­forms have demon­strat­ed promis­ing results, paving the way for more reli­able, effi­cient, and inte­grat­ed body-area net­works. These advance­ments rep­re­sent a sig­nif­i­cant leap in merg­ing human phys­i­ol­o­gy with cut­ting-edge wire­less tech­nolo­gies. The ses­sion will fea­ture results, among oth­ers, from the ongo­ing Hori­zon Europe Pathfind­er Open Project B‑cratos (Mod­ern BCI — B‑Cratos).

FS04 – Joint Communication and Sensing

Organized by: Padmanava Sen (Barkhausen Institut)

The ses­sion will cov­er the anten­na and pack­ag­ing aspects as well as beam pre­dic­tion in the con­text of Joint Com­mu­ni­ca­tions and Sens­ing (JC&S) Appli­ca­tions. Con­sid­er­ing hard­ware reuse, the design, and devel­op­ment of anten­nas will prove to be a key enabler for deploy­ment of JC&S sys­tems in 6G and beyond.

 

FS05 – DFG Priority Program “INTEREST-THz”

Organized by: Ullrich Pfeiffer (University of Wuppertal)

The INTER­EST-THz pro­gram aims to advance inter­dis­ci­pli­nary research in Ter­a­hertz (THz) tech­nolo­gies. The pro­gram focus­es on Inte­grat­ed Ter­a­hertz Sys­tems to enable nov­el func­tion­al­i­ties and appli­ca­tions. By fos­ter­ing col­lab­o­ra­tion across sci­en­tif­ic com­mu­ni­ties, the pro­gram seeks to over­come fun­da­men­tal per­for­mance lim­its and bridge the gap between dif­fer­ent sci­en­tif­ic dis­ci­plines. The research spans from chip-lev­el inte­gra­tion to sys­tem-lev­el inte­gra­tion, address­ing chal­lenges to imple­ment THz tech­nolo­gies in prac­ti­cal appli­ca­tions. The ulti­mate goal is to estab­lish a well-defined THz com­mu­ni­ty and enable ground­break­ing THz appli­ca­tions. The aim of this focus ses­sion is to present the fun­da­men­tal research work car­ried out with­in the INTER­EST-THz pro­gram.

FS06 – Electronics Packaging for RF-Applications – Integration Challenges and Solutions

Organized by: Krzysztof Nieweglowski, Karsten Meier and Karlheinz Bock (all TU Dresden)

Elec­tron­ics pack­ag­ing inte­gra­tion tech­nolo­gies are enablers for the real­iza­tion of RF-sys­tems with appli­ca­tion dri­ven require­ments in regard to the per­for­mance and cost-effi­cient fab­ri­ca­tion, e.g. Anten­na-in-Pack­age solu­tions can pro­vide small form fac­tor mod­ules with matched char­ac­ter­is­tics and low pow­er con­sump­tion. In this focused ses­sion, the experts will dis­cuss emerg­ing tech­nolo­gies for het­eroin­te­gra­tion of RF-sys­tems intro­duc­ing nov­el sub­strate mate­ri­als and man­u­fac­tur­ing meth­ods for mul­ti­lay­er sig­nal re-dis­tri­b­u­tion and feed­ing net­works incl. advanced RF-char­ac­ter­i­za­tion, explor­ing RF-matched assem­bly tech­nolo­gies as well as show­ing inno­v­a­tive sim­u­la­tion-dri­ven co-design tech­niques.

FS07 — High Performance mm-wave Technologies, Devices and Modules for sub-THz Applications

Organized by: Andreas Mai (IHP)

Mil­lime­ter wave and low-THz appli­ca­tions above 100 GHz are dom­i­nat­ed by dif­fer­ent tech­nol­o­gy plat­forms as InP and SiGe-BiC­MOS. They are among the most impor­tant plat­forms for appli­ca­tions in the mm-wave range and form the basis for a wide range of indus­tri­al appli­ca­tions in the field of com­mu­ni­ca­tion and sen­sor tech­nol­o­gy. The advan­tage of SiGe-BiC­MOS are their high lev­el of matu­ri­ty and reli­able pro­ducibil­i­ty, and by this they meet the require­ments for a wide range of appli­ca­tions in the “beyond 100 GHz” range. This ses­sion presents exam­ples of appli­ca­tions sub-THz plat­forms for bio­med­ical sens­ing and radar appli­ca­tions from aca­d­e­m­ic, RTO and indus­try. More­over, tech­nol­o­gy mod­ules as advanced var­ac­tor devices, sub-THz anten­nas and mm-wave pack­ag­ing are pre­sent­ed. The ses­sion close with an view on an InP-HBT tech­nol­o­gy for MMIC appli­ca­tions as a com­ple­men­tary suc­ces­sor or accom­plish­ing tech­nol­o­gy exten­sion for future THz appli­ca­tions.

… more com­ing soon.

Workshops

WS01 – Workshop on Energy-efficient Electronic Systems for the Tactile Internet

Organized by: Jens Wagner and Frank Ellinger (both TU Dresden)

The Tac­tile Inter­net presents unique require­ments, espe­cial­ly for elec­tron­ic sys­tems. Apart from low laten­cy, those sys­tems have to be as small as pos­si­ble to allow for sen­sor data gath­er­ing on the human body. To make this pos­si­ble, sev­er­al research groups joint forces and com­bined their exper­tise on ana­logue and dig­i­tal inte­grat­ed cir­cuit design and elec­tron­ic pack­ag­ing. This allowed for an opti­miza­tion of com­po­nents in every domain but also sparked new solu­tions at the inter­faces, mak­ing the result more than the sum of its pieces. We are going to present the results of this research, talk about the appli­ca­tion with­in a unique, inter­dis­ci­pli­nary envi­ron­ment and give an out­look towards future devel­op­ments such as ener­gy-autar­kic (“zero ener­gy”) or self-sup­ply­ing sys­tems and the trend towards cir­cu­lar econ­o­my.

 

WS02 – Integrated Sensing and Communications (ISAC): RF Hardware Enablement – antenna, front-end design and system level perspectives

Organized by: Padmanava Sen, M. Sajjad Ahmad (Barkhausen Institut)

This work­shop focus­es on the top­ic of hard­ware enable­ment for inte­grat­ed sens­ing and com­mu­ni­ca­tions (ISAC)/ Joint com­mu­ni­ca­tions and radio sens­ing (JC&S) in the scope of upcom­ing 6G tech­nol­o­gy. The niche of ISAC tech­nol­o­gy in the future 6G ecosys­tem, as well as sev­er­al poten­tial appli­ca­tions will be dis­cussed in the con­text of hard­ware enable­ment. The dif­fer­ent options depend­ing on the fre­quen­cy bands of use will be dis­cussed. After pre­sent­ing the state-of-art for the com­mon com­mu­ni­ca­tion and sens­ing fron­tend archi­tec­tures and anten­na options, poten­tial can­di­dates for the ISAC sce­nar­ios will be dis­cussed. Self-inter­fer­ence-can­cel­la­tion top­ic will be elab­o­rat­ed in detail as a key enabler for hard­ware reuse. A detailed analy­sis of the Key Per­for­mance Indi­ca­tors (KPIs) for com­mu­ni­ca­tion, radar and joint sys­tems will be cov­ered. Insights on sys­tem lev­el and mea­sure­ment val­i­da­tion using spe­cif­ic test­beds will also be giv­en. Future per­spec­tives and next steps on the path of enabling joint com­mu­ni­ca­tion and sens­ing tech­nol­o­gy will be giv­en at the end of this work­shop.

… more com­ing soon.

Chair for RF and
Pho­ton­ics Engi­neer­ing