Program

Link to Detailed Pro­gram Sched­ule

Sessions Overview

Mon­day — March 17, 2025
Time   Hör­saal 3 Hör­saal 4 Room 401 Room 403 Work­shops
 
10:00–11:30   Reg­is­tra­tion
11:30–12:30   Lunch
12:30–12:50   Open­ing Ses­sion (Audi­max)
12:50–13:50   Ple­nary Talks (Audi­max)
13:50–14:10   Break
14:10–15:50   Anten­nas 1 Radar 1 FS: Pack­ag­ing FS: Pho­ton­ics 1 WS: Rohde&Schwarz (Room 304)
15:50–16:50   Cof­fee Break
16:50–18:30   Anten­nas 2 Ampli­fiers 1 Con­trol cir­cuits FS: Pho­ton­ics 2 WS: Keysight
(Room 201)
18:30–19:15   (change loca­tion)
19:15–22:15   Wel­come Recep­tion at Dres­den Trans­port Muse­um
Tues­day — March 18, 2025
Time   Hör­saal 3 Hör­saal 4 Room 401 Room 403 Work­shops Room 405
 
08:20–09:40     Pas­sive
Com­po­nents 1		 Fron­tends
and Sources		 WS: ISAC WS: IHP Part 1
(Room 301)		  
09:40–10:30   Cof­fee Break
10:30–12:10   Anten­nas 3 Pas­sive
Com­po­nents 2		 Mea­sure­ment and Cal. Tech­niques FS: THz Inter­est WS: IHP Part 2
(Room 301)		 Poster 1
10:10–12:10
12:10–13:20   Lunch
13:20–14:20   Ple­nary Talks
14:20–14:40   Break
14:40–16:20   Com­mu­ni­ca­tion
Sys­tems		 THz Devices 1 Sen­sors 1 FS: Semi­con­duc­tor Tech­nol­o­gy WS Anrit­su
(Room 204)		  
16:20–17:10   Cof­fee Break
17:10–18:30   Radar 2 THz Devices 2 Sen­sors 2 WS: Tac­tile Inter­net    
18:30–19:15   (change loca­tion)
19:15–23:15   Con­fer­ence Din­ner at Löwen­saal Dres­den
Wednes­day — March 19, 2025
Time   Hör­saal 3 Hör­saal 4 Room 401 Room 403 Room 405
 
08:30–10:10   Semi­con­duc­tor and
Pack­ag­ing		 FS: BAC Ampli­fiers 2 FS: JC&S  
10:10–10:40   Cof­fee Break
10:40–11:10   Ple­nary Talks
11:10–11:30   Break
11:30–13:10   Trans­mit­ter Radar 3 Ampli­fiers 3 FS: THz Com­mu­ni­ca­tions Poster 2
11:20–13:20
13:10–13:20   Break
13:20–13:30   Awards & Clos­ing
13:30–14:30 Lunch

Focus Sessions

FS01 – THz Communications: Approaches for Circuit, Antenna, Signal Processing, and System Design

Organized by: Meik Dörpinghaus and Gerhard Fettweis (both TU Dresden)

Ter­a­hertz com­mu­ni­ca­tions promise very high data rates in future wire­less com­mu­ni­ca­tions sys­tems by exploit­ing the large avail­able band­width in the ter­a­hertz spec­trum. How­ev­er, for their real­iza­tion still many chal­lenges have to be addressed. In this regard, this spe­cial ses­sion will focus on var­i­ous aspects of future ter­a­hertz com­mu­ni­ca­tions sys­tems from anten­nas over cir­cuits to sig­nal pro­cess­ing and will bring togeth­er researchers from these dif­fer­ent areas.

FS02 – Photonic Integrated Circuits for Microwave/RF Signal Processing

Organized by: Kambiz Jamshidi (TU Dresden) and Thomas Schneider (TU Braunschweig)

Pho­ton­ic tech­nolo­gies offer extreme­ly high band­width, are immune to elec­tro­mag­net­ic inter­fer­ence with radio fre­quen­cies, and have the poten­tial to process high-band­width elec­tri­cal sig­nals from the microwave to the THz domain. Espe­cial­ly, pho­ton­ic inte­grat­ed cir­cuits (PICs) can pro­vide a solu­tion to real­ize small-foot­print devices with a low pow­er con­sump­tion that can be fab­ri­cat­ed in exist­ing foundries. In this focused ses­sion, researchers are invit­ed to sub­mit their research in the field of devices or sys­tems that ben­e­fit from PIC tech­nol­o­gy for pro­cess­ing microwave, RF, or THz sig­nals.

FS03 – Body Area Communications: Recent Advancements and Experimental Results

Organized by: Ilangko Balasingham (NTNU, Norway) and Robin Augustine (Upsala University, Sweden)

Body Area Com­mu­ni­ca­tions (BAC) encom­pass­es advanced tech­nolo­gies enabling seam­less inter­ac­tion between devices in or on the human body, such as wear­ables and implants. These sys­tems lever­age wire­less pow­er trans­fer and inno­v­a­tive tech­niques like backscat­ter com­mu­ni­ca­tion to opti­mize ener­gy effi­cien­cy. Emerg­ing meth­ods, such as fat intra-body com­mu­ni­ca­tion, exploit human tis­sue prop­er­ties to enhance sig­nal trans­mis­sion.

BAC sup­ports two-way com­mu­ni­ca­tion for stim­u­la­tion and sens­ing, allow­ing appli­ca­tions in health mon­i­tor­ing, ther­a­peu­tic inter­ven­tions, and aug­ment­ed human capa­bil­i­ties. Exper­i­men­tal plat­forms have demon­strat­ed promis­ing results, paving the way for more reli­able, effi­cient, and inte­grat­ed body-area net­works. These advance­ments rep­re­sent a sig­nif­i­cant leap in merg­ing human phys­i­ol­o­gy with cut­ting-edge wire­less tech­nolo­gies. The ses­sion will fea­ture results, among oth­ers, from the ongo­ing Hori­zon Europe Pathfind­er Open Project B‑cratos (Mod­ern BCI — B‑Cratos).

FS04 – Joint Communication and Sensing

Organized by: Padmanava Sen and M. Sajjad Ahmad (Barkhausen Institut)

The ses­sion will cov­er the anten­na and pack­ag­ing aspects as well as beam pre­dic­tion in the con­text of Joint Com­mu­ni­ca­tions and Sens­ing (JC&S) Appli­ca­tions. Con­sid­er­ing hard­ware reuse, the design, and devel­op­ment of anten­nas will prove to be a key enabler for deploy­ment of JC&S sys­tems in 6G and beyond.

 

FS05 – DFG Priority Program “INTEREST-THz”

Organized by: Ullrich Pfeiffer (University of Wuppertal)

The INTER­EST-THz pro­gram aims to advance inter­dis­ci­pli­nary research in Ter­a­hertz (THz) tech­nolo­gies. The pro­gram focus­es on Inte­grat­ed Ter­a­hertz Sys­tems to enable nov­el func­tion­al­i­ties and appli­ca­tions. By fos­ter­ing col­lab­o­ra­tion across sci­en­tif­ic com­mu­ni­ties, the pro­gram seeks to over­come fun­da­men­tal per­for­mance lim­its and bridge the gap between dif­fer­ent sci­en­tif­ic dis­ci­plines. The research spans from chip-lev­el inte­gra­tion to sys­tem-lev­el inte­gra­tion, address­ing chal­lenges to imple­ment THz tech­nolo­gies in prac­ti­cal appli­ca­tions. The ulti­mate goal is to estab­lish a well-defined THz com­mu­ni­ty and enable ground­break­ing THz appli­ca­tions. The aim of this focus ses­sion is to present the fun­da­men­tal research work car­ried out with­in the INTER­EST-THz pro­gram.

FS06 – Electronics Packaging for RF-Applications – Integration Challenges and Solutions

Organized by: Krzysztof Nieweglowski, Karsten Meier and Karlheinz Bock (all TU Dresden)

Elec­tron­ics pack­ag­ing inte­gra­tion tech­nolo­gies are enablers for the real­iza­tion of RF-sys­tems with appli­ca­tion dri­ven require­ments in regard to the per­for­mance and cost-effi­cient fab­ri­ca­tion, e.g. Anten­na-in-Pack­age solu­tions can pro­vide small form fac­tor mod­ules with matched char­ac­ter­is­tics and low pow­er con­sump­tion. In this focused ses­sion, the experts will dis­cuss emerg­ing tech­nolo­gies for het­eroin­te­gra­tion of RF-sys­tems intro­duc­ing nov­el sub­strate mate­ri­als and man­u­fac­tur­ing meth­ods for mul­ti­lay­er sig­nal re-dis­tri­b­u­tion and feed­ing net­works incl. advanced RF-char­ac­ter­i­za­tion, explor­ing RF-matched assem­bly tech­nolo­gies as well as show­ing inno­v­a­tive sim­u­la­tion-dri­ven co-design tech­niques.

FS07 — High Performance mm-wave Technologies, Devices and Modules for sub-THz Applications

Organized by: Andreas Mai (IHP)

Mil­lime­ter wave and low-THz appli­ca­tions above 100 GHz are dom­i­nat­ed by dif­fer­ent tech­nol­o­gy plat­forms as InP and SiGe-BiC­MOS. They are among the most impor­tant plat­forms for appli­ca­tions in the mm-wave range and form the basis for a wide range of indus­tri­al appli­ca­tions in the field of com­mu­ni­ca­tion and sen­sor tech­nol­o­gy. The advan­tage of SiGe-BiC­MOS are their high lev­el of matu­ri­ty and reli­able pro­ducibil­i­ty, and by this they meet the require­ments for a wide range of appli­ca­tions in the “beyond 100 GHz” range. This ses­sion presents exam­ples of appli­ca­tions sub-THz plat­forms for bio­med­ical sens­ing and radar appli­ca­tions from aca­d­e­m­ic, RTO and indus­try. More­over, tech­nol­o­gy mod­ules as advanced var­ac­tor devices, sub-THz anten­nas and mm-wave pack­ag­ing are pre­sent­ed. The ses­sion close with an view on an InP-HBT tech­nol­o­gy for MMIC appli­ca­tions as a com­ple­men­tary suc­ces­sor or accom­plish­ing tech­nol­o­gy exten­sion for future THz appli­ca­tions.

Workshops

WS01 – Workshop on Energy-efficient Electronic Systems for the Tactile Internet

Organized by: Jens Wagner, Johannes Partzsch, Krzysztof Nieweglowski and Frank Ellinger (all TU Dresden)

The Tac­tile Inter­net presents unique require­ments, espe­cial­ly for elec­tron­ic sys­tems. Apart from low laten­cy, those sys­tems have to be as small as pos­si­ble to allow for sen­sor data gath­er­ing on the human body. To make this pos­si­ble, sev­er­al research groups joint forces and com­bined their exper­tise on ana­log and dig­i­tal inte­grat­ed cir­cuit design and elec­tron­ic pack­ag­ing. This allowed for an opti­miza­tion of com­po­nents in every domain but also sparked new solu­tions at the inter­faces, mak­ing the result more than the sum of its pieces. We are going to present the results of this research, talk about the appli­ca­tion with­in a unique, inter­dis­ci­pli­nary envi­ron­ment and give an out­look towards future devel­op­ments such as ener­gy-autar­kic (“zero ener­gy”) or self-sup­ply­ing sys­tems and the trend towards cir­cu­lar econ­o­my.

WS02 – Integrated Sensing and Communications (ISAC): RF Hardware Enablement – antenna, front-end design and system-level perspectives

Organized by: Padmanava Sen and M. Sajjad Ahmad (Barkhausen Institut)

This work­shop focus­es on the top­ic of hard­ware enable­ment for inte­grat­ed sens­ing and com­mu­ni­ca­tions (ISAC)/ Joint com­mu­ni­ca­tions and radio sens­ing (JC&S) in the scope of upcom­ing 6G tech­nol­o­gy. The niche of ISAC tech­nol­o­gy in the future 6G ecosys­tem, as well as sev­er­al poten­tial appli­ca­tions, will be dis­cussed in the con­text of hard­ware enable­ment. The dif­fer­ent options depend­ing on the fre­quen­cy bands of use will be dis­cussed. After pre­sent­ing the state-of-art for the com­mon com­mu­ni­ca­tion and sens­ing fron­tend archi­tec­tures and anten­na options, poten­tial can­di­dates for the ISAC sce­nar­ios will be dis­cussed. Self-inter­fer­ence-can­cel­la­tion top­ic will be elab­o­rat­ed in detail as a key enabler for hard­ware reuse. A detailed analy­sis of the Key Per­for­mance Indi­ca­tors (KPIs) for com­mu­ni­ca­tion, radar, and joint sys­tems will be cov­ered. Insights on sys­tem lev­el and mea­sure­ment val­i­da­tion using spe­cif­ic test beds will also be giv­en. Future per­spec­tives and next steps on the path of enabling joint com­mu­ni­ca­tion and sens­ing tech­nol­o­gy will be giv­en at the end of this work­shop.

WS03 – Workshop On Microwave And Millimeter-Wave Characterization Of Materials In 1–170GHz Range

Organized by: Marzena Olszewska-Placha (QWED Sp. Z o.o., Poland), Bartlomiej Salski (Warsaw University of Technology, Poland), Andreas Henkel (Rohde&Schwarz, Germany)

This work­shop focus­es on pre­sent­ing state-of-the-art and nov­el microwave and mil­lime­ter-wave mate­r­i­al char­ac­ter­i­za­tion tech­niques (1–170 GHz) using res­o­nant meth­ods.

  • In part 1 we dis­cuss mea­sure­ment tech­niques for 1–30 GHz, focus­ing on dielectrics, semi­con­duc­tors, and cop­per foils char­ac­ter­i­za­tion using SPDR and Q‑SCR.
  • In part 2 the Fab­ry-Per­ot Open Res­onators (FPOR) for wide­band mate­r­i­al char­ac­ter­i­za­tion across 15–170 GHz is high­light­ed.
  • Key Focus Areas of the work­shop will be method advantages/limitations, mea­sure­ment aspects, error, and uncer­tain­ty analy­sis.
  • Prac­ti­cal Imple­men­ta­tion: Pre­sen­ta­tions, hands-on ses­sion with device manufacturers/developers, and Vec­tor Net­work Ana­lyz­er (VNA) oper­a­tion train­ing for mate­r­i­al mea­sure­ments.

WS04 – IHP’s Open Source SG13G2 PDK: Advancing RF and mm-Wave Design

Organized by: IHP

This work­shop intro­duces IHP’s open source SG13G2 Process Design Kit (PDK), designed to facil­i­tate inno­v­a­tive and acces­si­ble inte­grat­ed cir­cuit design for acad­e­mia and small-scale indus­try. The IHP Open­PDK offers a com­pre­hen­sive fea­ture set tai­lored to sup­port col­lab­o­ra­tive design work­flows and advance high-fre­quen­cy appli­ca­tions.

The ses­sion will high­light the DI-DEMICO project, which uti­lizes the PDK to push the bound­aries of RF and mm-wave design. Atten­dees will learn about key capa­bil­i­ties of the PDK, its role in enabling nov­el design method­olo­gies, and its impact on research and devel­op­ment in high-fre­quen­cy tech­nolo­gies.

By com­bin­ing insights into open-source EDA tools with prac­ti­cal appli­ca­tions, this work­shop pro­vides par­tic­i­pants an oppor­tu­ni­ty to explore cut­ting-edge advance­ments and dis­cuss future pos­si­bil­i­ties in RF and mm-wave design.

WS05 – Advanced Methods for Measurements and Calibrations supporting Broadband 6G component test with Modern VNAs

Organized by: Joel Dunsmore and Axel Hahn, Keysight

Time to upgrade your under­stand­ing of what’s pos­si­ble: Sub­stan­tial advances in mod­ern VNA capa­bil­i­ties in the past two years to enable pre­cise test­ing of 6G com­po­nents, includ­ing ful­ly char­ac­ter­i­za­tion of S‑parameters, Com­pres­sion, Noise Fig­ure and most par­tic­u­lar­ly mod­u­lat­ed mea­sure­ments such as EVM.

 
This work­shop will detail the best prac­tices for using VNAs with Sub-THz fre­quen­cy exten­ders for stan­dard S‑parameter mea­sure­ments and new capa­bil­i­ties to gen­er­ate, cal­i­brate, and mea­sure com­plex mod­u­lat­ed sig­nals.  This new capa­bil­i­ty is par­tic­u­lar­ly impor­tant in sub-THz bands, where cur­rent state-of-the-art meth­ods require gen­er­at­ing base­band mod­u­lat­ed sig­nals and up-con­vert­ing them to the sub-THz band; this process adds ampli­tude, phase and dis­tor­tion errors. Using cal­i­brat­ed VNA-based mea­sure­ments, these errors can be cor­rect­ed using Dig­i­tal Pre-Dis­tor­tion (DPD) to gen­er­ate pure mod­u­lat­ed sig­nals in these bands.
 
Final­ly, the band­widths pro­posed for 6G are much wider (up to 20 GHz or more) than cur­rent sig­nal ana­lyz­er capa­bil­i­ties in the indus­try, but using syn­chro­nous VNA mea­sure­ment meth­ods, we show demod­u­la­tion capa­bil­i­ties, using Vec­tor Spec­trum Analy­sis soft­ware (Keysight’s 89600 VSA) demon­strat­ing less that 1% EVM floor at 250 GHZ cen­ter fre­quen­cy.  All of these tech­niques can be used with­out fre­quen­cy exten­ders for low­er fre­quen­cy appli­ca­tions such as Ku and Ka band sat-com bands, and these will be dis­cussed as well.
 
 

WS06 – RCS and RIS Measurement Workshops

Organized by: Ferdinand Gerhades  (Anritsu)

This work­shop con­sists of two parts:

E‑Band VNA — RCS Measurement Workshop

The radar cross sec­tion (RCS) of a tar­get is the equiv­a­lent area seen by a radar. It is the fic­ti­tious area inter­cept­ing that amount of pow­er which, when scat­tered equal­ly in all direc­tions, pro­duces an echo at the radar equal to that from the tar­get. The RCS of a tar­get can also be inter­pret­ed as a mea­sure of its degree of vis­i­bil­i­ty to a radar. Tar­get RCS mea­sure­ments are usu­al­ly per­formed in the 1 to 20 GHz fre­quen­cy range, for some small­er objects even up to 40 GHz or even in the mil­lime­ter-wave e.g., for pas­sive mil­lime­ter-wave iden­ti­fi­ca­tion tags.

This work­shop is uti­liz­ing a nov­el E‑Band VNA MS46522B-082 for 55–92 GHz Over-the-Air (OTA) Appli­ca­tions. The par­tic­i­pant will built-up an OTA set­up using the VNA and a pair of dielec­tric high gain anten­nas to mea­sure the reflec­tiv­i­ty of some stan­dard spher­i­cal objects and try to cal­cu­late the RCS there­of.

PhaseLync — RIS Measurement Workshop

Meta­ma­te­ri­als allow the manip­u­la­tion of their elec­tro­mag­net­ic reflec­tion and refrac­tion char­ac­ter­is­tics. They are key for Recon­fig­urable Intel­li­gent Sur­faces (RIS) con­cepts and pro­vide a solu­tion to the com­mon­ly valid expec­ta­tion of spec­u­lar reflec­tions, i.e. they allow arbi­trary angles of reflec­tion. The same applies to refrac­tion angles when using trans­par­ent meta­ma­te­ri­als. Fur­ther­more, shap­ing the reflect­ed sig­nal (in terms of beam width, for instance) is also pos­si­ble, as it is chang­ing the polar­iza­tion planes.

In this work­shop, the par­tic­i­pant is using a nov­el dis­trib­uted VNA con­cept based on ME7869A up to 43.5 GHz and aims to mea­sure the spec­u­lar reflec­tion of a TMYTEK active RIS and gain­ing var­i­ous Fig­ure of Mer­it (FOM). The mea­sure­ments and FOM can be com­pared using a MS2760A Ultra­portable Spec­trum Ana­lyz­ers, one of the small­est form­fac­tors for mil­lime­ter-wave mea­sure­ments up to 170 GHz nowa­days.

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Logo Institut für Mikrowellen- und Antennentechnik e.V.

Chair for RF and
Pho­ton­ics Engi­neer­ing

  • TU Dres­den
    Pro­fes­sur für Hochfre­quen­ztech­nik
    Helmholtzs­traße 10
    01069 Dres­den, Ger­many
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